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HPEC '18 Call For Papers

December 12, 2017

The technical committee of the 2018 IEEE High Performance Extreme Computing Conference (HPEC ’18 to be held in the Greater Boston Area, Massachusetts, USA, 25 – 27 September, 2018) seeks new presentations.Presentations should clearly describe advances in high performance extreme computing technologies, emphasizing one or more of the following topics:

  • Machine Learning
  • Graph Analytical and Network Science
  • Advanced Multicore Software Technologies
  • Automated Design Tools
  • Big Data and Distributed Computing
  • Big Data Meets Big Compute
  • Case Studies and Benchmarking of Applications
  • Cloud HPEC
  • Computing Technologies for Challenging Form Factors
  • Data Intensive Computing
  • Digital Front Ends
  • Fault-Tolerant Computing
  • General Purpose GPU Computing
  • High Performance Data Analysis
  • Interactive and Real-Time Supercomputing
  • Mapping and Scheduling of Parallel and Real-Time Applications
  • New Application Frontiers
  • Open System Architectures
  • Secure Computing & Anti-Tamper Technologies

Important Dates:

Submission Deadline: May 18, 2018
Notification of Acceptance: July 1, 2018
Camera Ready Deadline: August 1, 2018

HPEC accepts two types of submissions:
1. Full papers (up to 6 pages, references not included), and
2. Extended abstracts (up to 2 pages, references included).
Preference will be given to papers with strong, quantitative results, demonstrating novel approaches or describing high quality prototypes. Authors of full papers can mark their preference for a poster display or an oral presentation. Presenters who wish to have hardware demonstrations are encouraged to mark their preference for a poster display. Accepted extended abstracts will be displayed as posters. All paper and extended abstract submissions need to use the approved IEEE templates.
Full paper submissions with the highest peer review ratings will be published by IEEE in the official HPEC proceedings available on IEEE eXplore. All other accepted submissions and extended abstracts are published on ieee-hpec.org. Vendors are encouraged to sign up for vendor booths. This will allow vendors to present their HPEC technologies in an interactive atmosphere suitable for product demonstration and promotion.
Papers can be declared “student paper” if the first author was a student when doing the presented work, and will be eligible for the “IEEE HPEC best student paper award.” Papers should not be anonymized.
Organizers welcome input (hpec@nullieee-hpec.org) on tutorials, invited talks, special sessions, peer reviewed presentations, and vendor demos.

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